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  power transistors 1 2sb0940, 2sb0940a 2sb0940, 2sb0940a 2sb0940, 2sb0940a 2sb0940, 2sb0940a 2sb0940, 2sb0940a (2sb940, 2sb940a) (2sb940, 2sb940a) (2sb940, 2sb940a) (2sb940, 2sb940a) (2sb940, 2sb940a) silicon pnp epitaxial planar type for power amplification for tv vertical deflection output complementary to 2sd1264 and 2sd1264a  features ? high collector to emitter voltage v ceo ? large collector power dissipation p c ? full-pack package which can be installed to the heat sink with one screw  absolute maximum ratings t c = 25 c 1 : base 2 : collector 3 : emitter eiaj : sc-67 to-220f package unit: mm  electrical characteristics t c = 25 c parameter symbol rating unit collector to base 2sb0940 v cbo ? 200 v voltage 2sb0940a ? 200 collector to 2sb0940 v ceo ? 150 v emitter voltage 2sb0940a ? 180 emitter to base voltage v ebo ? 6v peak collector current i cp ? 3a collector current i c ? 2a collector power t c = 25 cp c 30 w dissipation t a = 25 c2 junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c parameter symbol conditions min typ max unit collector cutoff current i cbo v cb = ? 200 v, i e = 0 ? 50 a emitter cutoff current i ebo v eb = ? 4 v, i c = 0 ? 50 a collector to base voltage v cbo i c = ? 50 a, i e = 0 ? 200 v collector to emitter 2sb0940 v ceo i c = ? 5 ma, i b = 0 ? 150 v voltage 2sb0940a ? 180 emitter to base voltage v ebo i e = ? 500 a, i c = 0 ? 6v forward current transfer ratio h fe1 * v ce = ? 10 v, i c = ? 150 ma 60 240 h fe2 v ce = ? 10 v, i c = ? 400 ma 50 base to emitter voltage v be v ce = ? 10 v, i c = ? 400 ma ? 1v collector to emitter saturation voltage v ce(sat) i c = ? 500 ma, i b = ? 50 ma ? 1v transition frequency f t v ce = ? 10 v, i c = ? 0.5 a, f = 10 mhz 30 mhz rank q p h fe1 60 to 140 100 to 240 10.0 0.2 5.5 0.2 7.5 0.2 16.7 0.3 0.7 0.1 14.0 0.5 solder dip (4.0) 0.5 +0.2 ?0.1 1.4 0.1 1.3 0.2 0.8 0.1 2.54 0.3 5.08 0.5 2 13 2.7 0.2 4.2 0.2 4.2 0.2 3.1 0.1 note) * : rank classification note.) the part numbers in the parenthesis show conventional part number.
power transistors 2 2sb0940, 2sb0940a v ce(sat) ? i c h fe ? i c f t ? i c p c ? t a i c ? v ce i c ? v be area of safe operation (aso) r th(t) ? t 0 160 40 120 80 140 20 100 60 0 50 40 30 20 10 (1) t c =ta (2) with a 100 100 2mm al heat sink (3) with a 50 50 2mm al heat sink (4) without heat sink (p c =2w) (1) (4) (3) (2) ambient temperature t a ( ?c ) collector power dissipation p c ( w ) 0 12 10 8 2 6 4 0 600 500 400 300 200 100 t c =25 ? c 4.0ma 3.5ma 3.0ma 2.5ma 2.0ma 1.5ma 1.0ma 0.5ma i b = 4.5ma collector to emitter voltage v ce ( v ) collector current i c ( a ) 0 1.0 0.8 0.2 0.6 0.4 0 2.0 1.6 1.2 0.8 0.4 t c =100 ? c 25 ? c 25 ? c v ce = 10v base to emitter voltage v be ( v ) collector current i c ( a ) 0.01 3 1 0.1 0.03 0.3 0.01 0.03 0.1 0.3 1 3 10 i c /i b =10 t c =100 ? c 25 ? c 25 ? c collector current i c ( a ) collector to emitter saturation voltage v ce(sat) ( v ) 0.01 0.1 1 10 0.03 0.3 3 1 3 10 30 100 300 1000 3000 10000 v ce = 10v t c =100 ? c 25 ? c 25 ? c collector current i c ( a ) forward current transfer ratio h fe 0.01 0.1 1 10 0.03 0.3 3 1 3 10 30 100 300 1000 3000 10000 v ce = 10v f=10mhz t c =25 ? c collector current i c ( a ) transition frequency f t ( mhz ) 1 10 100 1000 3 30 300 0.01 0.03 0.1 0.3 1 3 10 30 100 t=0.5ms 5ms 1ms i cp i c 2sb0940a 2sb0940 non repetitive pulse t c =25 ? c dc collector to emitter voltage v ce ( v ) collector current i c ( a ) 10 4 10 10 3 10 1 10 2 110 3 10 2 10 4 10 2 10 1 1 10 10 3 10 2 (1) (2) (1) without heat sink (2) with a 100 100 2mm al heat sink time t ( s ) thermal resistance r th (t) ( ? c/w )
please read the following notes before using the datasheets a. these materials are intended as a reference to assist customers with the selection of panasonic semiconductor products best suited to their applications. due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. b. panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. therefore, panasonic will not assume any liability for any damages arising from any errors etc. that may ap- pear in this material. c. these materials are solely intended for a customer's individual use. therefore, without the prior written approval of panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the internet or in any other way, is prohibited. request for your special attention and precautions in using the technical information and semiconductors described in this material (1) an export permit needs to be obtained from the competent authorities of the japanese govern- ment if any of the products or technologies described in this material and controlled under the "foreign exchange and foreign trade law" is to be exported or taken out of japan. (2) the technical information described in this material is limited to showing representative character- istics and applied circuit examples of the products. it does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) the products described in this material are intended to be used for standard applications or gen- eral electronic equipment (such as office equipment, communications equipment, measuring in- struments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. at the final stage of your design, purchas- ing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the guaranteed values, in particular those of maxi- mum rating, the range of operating power supply voltage and heat radiation characteristics. other- wise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) when using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) no part of this material may be reprinted or reproduced by any means without written permission from our company. 2001 mar


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